SMARTCOMP 2023

Call for WIP/Demos (Download PDF)

SMARTCOMP 2023 is the 9th edition of the premier conference on Smart Computing. Smart computing is a multidisciplinary domain based on the synergistic influence of advances in sensor-based technologies, the Internet of Things, cyber-physical systems, edge computing, big data analytics, machine learning, cognitive computing, and artificial intelligence. Applications of smart computing can be found in different societal domains including, but not limited to, transportation, energy, environmental protection, smart and connected communities, healthcare, banking, industrial systems, entertainment, and social media. Algorithmic and system advancements in cloud computing, mobile/pervasive computing, cyber-physical systems, sensor networking, and social computing are taking smart computing to a new dimension and improving our ways of living.

SMARTCOMP Poster, Demo, and WiP sessions will provide a forum to discuss novel ideas and emerging results, present innovative applications and tools, and bring about novel research questions, approaches, and directions. The work-in-progress track will particularly provide a forum to discuss describing preliminary work on theory, platform design and implementation, verification and validation, empirical case studies, and other work that has the potential to advance the state of the art in CPS.

Authors of papers that received favorable reviews but could not be accepted to the main track may be offered the opportunity to publish their submitted work in the Work-in-Progress or poster tracks.

Topics

Areas of interest include (but are not limited to):

Submission Guidelines

Titles in this track should follow the following formats below: 

Demo, poster, and WiP papers should be no more than 3 pages in length, including figures, tables, and references and formatted according to the two-column IEEE proceedings template. IEEE provides corresponding formatting templates at IEEE proceedings template. IEEE provides corresponding formatting templates at IEEE conference template. Make sure to use the conference mode of the template, i.e., LaTeX users must use the conference option of the IEEEtran document class.

While accepted submissions in the poster track will be presented as part of the “poster session,” the submissions must be in the form of short papers, as mentioned above. While posters will be non-archival, the demo and WiP papers will be published in the conference proceedings and submitted to the IEEE Xplore Digital Library. 

While the submission format is the same, the goals for posters, demos, and WiP are different, i.e.

All submitted demo and poster papers will be subject to peer reviews by SMARTCOMP Technical Program Committee members and other experts in the field. At least one author of each accepted paper must register and attend the conference to present the work.

How to submit?

Papers must be submitted electronically as a single PDF file on US Letter size paper (not A4), with all fonts embedded (the PDF-A standard complies with that), through EDAS. Select WiP/Demo/Poster Track at the following link: https://edas.info/newPaper.php?c=30194.

Important Dates

WIP/Demo/Poster Co-Chairs